漢高粘合劑技術事業(yè)部主營漢高樂泰工業(yè)粘合劑、結構膠，瞬干膠，平面密封膠，圓柱固持膠，漢高樂泰UV紫外線光固化膠，底部填充膠，低溫固化環(huán)氧膠，密封劑和表面處理產(chǎn)品。在世界粘合劑、密封劑及表面處理領域，漢高是全球市場的{ldz}，擁有諸如Loctite, Teroson, P3, Hysol, 等眾多強大品牌。銷\處售\電\話\137、5113、6332.陳生 Q.Q3022/24/564/LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is
designed for CSP and BGA applications. This low viscosity material is
formulated to flow at room temperature with no additional preheating
required. It cures quickly at moderate temperatures to minimize stress
to other components. When cured, this material has a high glass
transition temperature while maintaining flexibility in order to protect
solder joints during thermal cycling and drop testing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 20 rpm 354
Specific Gravity 1.16
Pot Life @ 25oC, days 3
Shelf Life @ -20°C, days 365
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